Mission
Soitec—Leading the SOI Substrate Revolution
For more than a decade, Soitec has helped IC manufacturers reap the benefits of silicon-on-insulator (SOI) wafers on an industrial scale, thanks to its unique Smart Cut™ technology, which is key to producing these advanced substrates in volume quantities. Today, the company is the world’s leading supplier of SOI wafers, as well as an innovation leader in this important growth market—serving as a catalyst for collaboration and materials innovation in SOI and other engineered substrates.
Soitec leverages its patented Smart Cut technology to manufacture a comprehensive portfolio of SOI and other engineered substrates. With its proven ability to deliver competitive production advantages, as well as the productivity needed to support mass SOI adoption, Smart Cut has enabled Soitec to further strengthen its position as the technological and industrial leader at a time when the market is seeing extremely strong growth.
To ensure multiple sourcing for our clients, Soitec also sub-license its process technology. The result: today, approximately 95 percent of all SOI wafers acquired for production are built using Soitec’s Smart Cut™ process technology.
The Soitec Group
The group’s headquartered are in Bernin, France, with offices in the United States, Japan and Taiwan.
The Soitec Group is the world’s leading innovator and provider of the engineered substrate solutions that serve as the foundation for today’s most advanced microelectronic products.
The group leverages its proprietary Smart Cut™ technology to engineer new substrate solutions.
Soitec is the world’s leading manufacturer of Silicon-On-Insulator (SOI) wafers for high-performance microprocessors and other devices.
With a new manufacturing site in Singapore (open in mid-2008), the Soitec Group is increasing capacity to meet the industry’s forecast requirements.
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