This whitepaper is a deep dive into the evolution of wireless connectivity protocols, including Wi-Fi and cellular, and how they are adapting to meet the demands of IoT. It offers a showcase of our innovations in engineered substrates developed specifically to address the challenges of IoT, including seamless RF and #microwave coexistence.
Photonics Shines in the Age of AI :
Check out SOITEC Silicon Photonics white paper in the March 2024 issue of Photonics Spectra magazine. The issue covers how photonics is and will be shaping future scaling, cost, and performance of the AI infrastructure.
This paper describes how Soitec‘s innovative metrology on its wafers is able to predict the RF performance of final devices manufactured on Soitec RFeSITM substrates.
This paper explains the value of using RF-SOI substrates and what the latest generation of Soitec Wave SOI™ (Soitec eSI™) brings to RF IC performance while simplifying the IC manufacturing process in order to address the mainstream smart phone market.
For continued attractiveness and competitiveness of advanced electronic appliances such as smartphones, TVs, notebooks or tablets, the semiconductor industry is moving to “fully depleted” transistor technology to build integrated circuits.
This document considers the challenges to obtain competitive silicon technology for the upcoming generation of System-On-Chip ICs. It suggests planar fully depleted technology deserves serious interest.
The Competitive Advantage Mobile Silicon Technology