Connect POI
RF FILTERS for SMARTPHONE
Our Piezoelectric-on-Insulator (POI) engineered substrates address the needs for high performance and increasingly complex 5G radiofrequency filters in smartphones and other devices
Our Connect - POI engineered substrates product portfolio allows to manufacture high performance surface acoustic wave (SAW) filter components that improves the efficiency of RF FE modules operating in sub-6Ghz spectrum.
Connect - POI Substrates
Soitec Connect - POI engineered substrates enable the design of filters with high quality factor, large bandwidth, very low temperature sensitivity and low insertion loss with a simple device manufacturing technology. They also provide the capability to integrate multiple filters on the same die and to address the requirements of all frequency bands in sub-6GHz spectrum.
CONNECT- POI SUBSTRATES LEVERAGING SMART CUT™ TECHNOLOGY
Soitec Connect - POI engineered substrates are built using SMART CUT™ technology which allows to provide a thin uniform layer of monocrystal piezo material.
The POI substrate is made of three layers: a piezoelectric material, a buried oxide and a silicon layer. The buried oxide selects and guides only high velocity waves, allowing to limit the losses and to ensure a very high signal selectivity. It also keeps the piezo material constrained against temperature variations, ensuring outstanding frequency stability when temperature changes.
Our Piezoelectric-On-Insulator Connect-POI advanced substrates are covered by one or more patents listed here.
Specification:
Available in 150mm wafer
Piezo material: Lithium Tantalate (LiTaO3)
PIEZOELECTRIC EXPERTISE
Soitec develops innovative substrates using piezoelectric materials. These substrates are currently used to manufacture elastic wave components such as radio frequency band filters.
The development of these new substrates draws on the expertise of its team, which was spun off from frec|n|sys, a company acquired in 2017 and based in Besançon (France). This team specializes in the design, modeling, characterization and manufacture of small series of elastic wave components.