Connect HR-SOI

The HR-SOI substrate was introduced during the boom of 3G and beginnings of 4G LTE and it is currently in use for IoT RFFE and discrete RF blocks for entry level 3G, 4G LTE feature and smartphones as well as infrastructure.

Thanks to the expertise gathered over many years, Soitec offers HR-SOI substrates with the highest levels of layers uniformity and thickness control available in the market.

Whatever the technology node – from some nm to hundreds of μm - to be integrated on top of the substrate you can count on Soitec’s HR-SOI to reach your development targets.