Connect POI substrates
Tailored multilayers piezoelectric substrates enable high-performance RF filters with best-in-class uniformity, thanks to Smart Cut™ technology.
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Connect Piezoelectric Materials on Insulators
The Connect POI substrate, Piezoelectric On Insulators substrate, combined with InterDigital Transducers, enables the creation of high-performance SAW filters that meet the demands of stringent telecommunication bands by offering improved RF performance through a higher quality factor (Q) and lower insertion losses (IL). Additionally, it provides better thermal properties, including a low temperature coefficient of frequency (TCF) and enhanced thermal dissipation. The substrate also supports flexible bandwidth thanks to an appropriate acoustic coupling factor (k²), well-matched phase velocity, and multiplexing capability. Furthermore, it is well-suited for high-volume manufacturing: it offers robustness and compatibility with advanced package and assembly flows for Front-End modules.
Connect POI portfolio
Connect POI description
The multilayers Connect POI substrate is composed of four layers. Used piezoelectric materials are Lithium Tantalate LiTaO3 and Lithium Niobate LiNbO3.
LT6-MHB product
150 mm wafer size addressing the RF Filter Mid High Band segment, from 1 to 3+ GHz.
Multiple Silicon orientations and Euler Angles are available.
LT6-LB product
150 mm wafer size addressing the RF Filter Low Band segment, below 1 GHz.
Multiple Silicon orientations and Euler Angles available.
LN6 product
150 mm wafer size with LiNbO3 , addressing wider RF bands of the RF Filter segments, up to 3+ GHz.
LT8-MHB & LT8-LB products
200 mm wafer size addressing the RF Filter Mid High Band and Low Band segments, up to 3+ GHz.
Connect POI boosts the communications speed & rate between connected equipments, reducing the consumption
The versatile Connect POI substrate offers the options to tailor the type of filter skirt of any 5G New Radio band, for any data rate and speed. Coexistence in a massive connected network is not an issue anymore. Nor the integration into compact systems. Connect POI even enables multiplexing to filter several bands on the same die. It also empowers the communication system to lower consumption for data transmission, serving ideally the 5G smartphone and tablet battery life.
Connect POI technology makes the bluetooth integration into smartglasses possible : it enables coexistence with the increased allocation of 5G bands thanks to high-selectivity filters ! Moreover, the ML-SAW filter on POI is very compact. Moreover, the ML-SAW on POI enables the whole telecommunication channel to work with a lower consumption : perfect for those bright glasses to stay light and longer, with the objective of achieving one operating day without charge-in!
Whatever the accuracy requested, for autonomous car or smartphone positioning, the filter needs to segregate the Global Navigation Satellite System (GPS, Glonass, Galileo, BeiDou, NavIC, QZSS) tracking signal from any other transmitted telecommunication. Selectivity, isolation, and low consumption are the Connect POI features enabling this ! Achievable miniaturization is an additional benefit for the wearable market !
Highlights
Gain for Tx filters
Gain for Rx filters
Connect POI empowers DMS, Double Mode SAW, and innovative architectures, as it offers extremely low Insertion Loss and out-of-band attenuation options. Demanding specifications of Rx filters can be reached, responding to Adjacent Channel Rejection and Adjacent Channel Selectivity requirements. Advantages listed for the Tx filters are also applicable for the Rx filters
Multiplexing, from duplexer to x-plexer
Duplexer can be designed by combining the both previous approaches of Rx and Tx filters on POI. The Connect POI versatility enables also to integrate, on a same die, some filters addressing different frequencies: diplexer and multiplexer can be then integrated on a single chip, with a single IDT metal layer. Reached cross-isolation or isolation across bands is sufficient between the aggregate paths.
Ease of filter manufacturing and assembly
Advantages of a SAW on POI compared to a SAW on piezoBulk
The POI multilayers stack offers better waveguide performances, boosting the piezoelectric properties, and limiting its thermoelastic variations. All, on a robust mechanical substrate ! Moreover a substrate stack can be designed to optimize performance across various frequency bands, enabling efficient multiplexing !
5G bands selectivity & coexistence with WiFi
Connect POI is capable of addressing the whole spectrum, including LTE, 5G, and beyond, enabling energy efficient RF filter designs with compact footprint. Which leads to address multiple markets : Mobile Market,IoT Market,Non Terrestrial Network and SATCOM.
Learn more about Connect POI
Frequently asked questions
The RF filter is the first function next to the antenna. It is also present on the whole RX / TX receive/transmit channel, specific to each telecommunication standard, such as GSM, 5G, GNSS, NTN,....
Typically, a piezoelectric material is bonded on a Silicon substrate, using a silicon dioxide layer at the interface. It is a wafer technology enabling better acoustic filtering performances than bulk materials.
Connect POI is the Soitec’s POI substrate optimized to boost performances of SAW on POI.
Piezoelectricity is a reverse phenomenon of physics that converts mechanical energy into electrical one. Piezoelectric materials are commonly used for RF Filter applications, using two main technologies : Bulk Acoustic Wave, called BAW, and Surface Acoustic Wave, called SAW.
SAW on POI filters are composed of metallic InterDigital Transducers, patterned on a POI substrate. The selected wave energy is confined within the top layer.
The POI multilayers stack offers better waveguide performances, boosting the piezoelectric properties, and compensating for its thermoelastic variations. All, on a robust mechanical substrat. Multiplexing is achievable thanks to the versatility of the whole POI multilayers substrate.
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