Our Smart Photonics SOI product line leverages our dedicated Photonics-SOI technology for datacom applications and systems, combining cutting-edge optical functions with electronic circuits in a small form-factor. Smart Photonics SOI also applies in 3D sensing, healthcare monitoring, Lidar or quantum applications.
Silicon Photonics is leveraging platforms for datacom to achieve a best-in-class ratio pJ/bit/mm2. CMOS process Leverage high volume manufacturing for high-speed transceivers and the evolution to optical I/Os for chip to chip interconnect at competitive cost.
Key markets and related applications
Silicon photonics opens a new era by offering high-data-rate and cost-effective solutions.
Basics of the Silicon-Photonics
Typical Photonics-SOI is defined by: 2µm BOX with 220nm Top Silicon layer
Soitec offers variations of single SOI in 200mm and 300mm wafer as well as double SOI:
- Highly uniform top silicon layer: 0,1µm to 20 µm (EPI)
- Buried oxide layer: 50nm to 3µm
- High resistivity handle wafer
- Low Bulk Micro Defect (BMD) handle wafer
Key Material Performances
- Best-in-class uniformity of SOI and BOX layers
- Flawless surface
- Low Roughness at Silicon interfaces
- High Crystalline-quality layer
User Benefits
- Signal integrity with low-loss waveguide
- Signal quality with optimal optical confinement
- High RF immunity
- Complex monolithic integration of photonics blocks
SOI-based photonics substrates obtained with Smart Cut™ proprietary technology take advantage of the atomically flat and uniform Silicon crystalline layer enabling light routing through sub-micrometer-scale optical waveguides.