Tackling system scaling challenges on the fronts of power, heat, memory, and compute requires combined technology, system and circuit research. Continued transistor scaling will go hand in hand with approaches such as advanced optical and electrical interconnects. New compute solutions for AI are pushing the boundaries of what is possible, enabling more efficient and powerful AI applications. Catalyzed by initiatives such as the worldwide Chips Acts, these core innovations will move to the market much quicker than before – powering AI-enabled applications in domains such as automotive, health, consumer products, and many more.