Technology
Back
Technology
Innovation
Back
Technological Innovation
Smart Cut™
Beyond Silicon
Smart Stacking™
Semiconductor Ecosystem
Manufacturing
Back
Wafer Manufacturing
Semiconductor Fabs
Collaborative Funded Projects
Polishing & Reclaim Services
Products
Back
Products
Markets
Back
Mobile Communications
Automotive
Industry
Edge AI & Internet of Things
Cloud AI & Network Infrastructure
Product Platforms
Back
RF-SOI
FD-SOI
POI
RF-GaN
Power-SOI
SmartSiC™
Photonics-SOI
Imager-SOI
PD-SOI
MEMS-SOI
Group
Back
Group
History
Governance
Quality
Locations
Newsroom
Events
People
Back
People
Life at Soitec
Diversity & Inclusion
Students & Graduates
Purpose & Values
Interviews
Commitments
Back
Commitments
Environment
Ethics
Diversity, Equity & Inclusion
Sustainability
Investors
Back
Investors
Shareholders & Analysts
Back
Share & Analyst coverage
Shareholding structure
Becoming a shareholder
Shareholders' general meetings
Governance
Back
Governance Overview
Board of Directors
Board Committees
Executive Committee
Corporate officers compensation
Corporate documents
Internal Control & Risk Factors
Related-party agreements
Regulated information
Back
Regulated information overview
Financial reports, results & other regulated releases
Voting rights & Share capital information
Share buyback program & Liquidity contract
Shareholders' general meetings
Contact
When autocomplete results are available use up and down arrows to review and enter to select.
English
Languages
English
Regional Page
日本語
中文
한국어
台灣人
Home
Group
Resource Library
201703_declaration_ddv_en
pdf
Download
201703_declaration_ddv_en
(pdf)
362 KB
October 7, 2024
Download
QUICK LINKS
Group
Jobs at Soitec
Investor Relations
Shareholders
Products
Commitments
Newsroom
Events
REGIONAL PAGES
Japan
China
Korea
Taiwan
Soitec, a world leader in innovative semiconductor materials
©2026 Soitec
Terms of Use
Personal Data
Accessibility: partially compliant
Cookies
English
